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About Luphi

Electronic Integration and Assembly

Electronic integration and assembly involve combining various components into a complete product, including enclosures, PCBA, membrane switches, silicone rubber keypad, display devices, touchscreens, cables, various screws and nuts, etc. It plays a crucial role in modern electronic information manufacturing.

Electronic Integration and Assembly

In integration electronics assembly, PCB assembly is the core of the core. The PCBA is the central component that controls the functions of the electronic assembly. Here is the process of Luphi Electronics' PCBA assembly and processing:
Circuit Board Manufacturing: The circuit board is the foundation of electronic assembly processing.  It is a carrier that holds and connects electronic components. Common circuit boards include rigid  circuit boards, flexible circuit boards, and rigid-flex boards. The manufacturing process mainly includes schematic design, circuit board fabrication, and component mounting hole processing.
Component Selection and Procurement: Selecting and purchasing various electronic components needed for the PCBA design, including transistors, resistors, capacitors, etc.
Circuit Board Assembly Processing: This mainly includes SMT (Surface Mount Technology) placement processing and DIP (Dual In-line Package) assembly processing.
Function Testing: After the PCB assembly processing is completed, the circuit board must undergo functional testing to ensure the product's normal operation.

Luphi Electronics' PCBA Capabilities

Factory Certifications: ISO9001/ISO13485/ISO14001/ISO45001.
Standards Implemented: IPC-A-610H.
Processing Techniques: SMT placement, DIP assembly processing, conformal coating spraying, wave soldering, reflow soldering, AOI (Automated Optical Inspection).
Product Certifications: UL, RoHS, Reach, SGS.
SMD Capabilities: Minimum size 01005, BGA 0.2mm, OFN, CSP, CON.
Functional Testing: SPI (Solder Paste Inspection), AOI, X-Ray, FAI (First Article Inspection), FCT (Functional Circuit Testing), ICT (In-Circuit Testing), aging testing, etc.

Luphi Electronics' PCBA Capabilities

Factory Certifications: ISO9001/ISO13485/ISO14001/ISO45001.
Standards Implemented: IPC-A-610H.
Processing Techniques: SMT placement, DIP assembly processing, conformal coating spraying, wave soldering, reflow soldering, AOI (Automated Optical Inspection).
Product Certifications: UL, RoHS, Reach, SGS.
SMD Capabilities: Minimum size 01005, BGA 0.2mm, OFN, CSP, CON.
Functional Testing: SPI (Solder Paste Inspection), AOI, X-Ray, FAI (First Article Inspection), FCT (Functional Circuit Testing), ICT (In-Circuit Testing), aging testing, etc.

Luphi Electronics' Integration Assembly Supply Chain Capabilities

Located in the world-famous manufacturing city of Dongguan, China, Luphi Electronics has established long-term and stable partnerships with surrounding suppliers of metal, plastic, silicone, and wires. All partners are carefully selected by Luphi Electronics and meet our standards in terms of quality, delivery time, and service. They fully support the quality and delivery time requirements of Luphi Electronics' integration assembly business.
Industries Served by Luphi Electronics Integration Assembly Services
Currently, Luphi Electronics' integration assembly services are mainly applied in the industrial control and medical fields. Feel free to contact us via phone or email for inquiries!

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CONTACT INFO
Tel: +86-134-3741-0111
Add: 1/F, Building 3 of Hesen Industrial Park 523926, Huailin Rd., Huaide Area, Humen Town, Dongguan, Guangdong, China
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